Eecient Techniques for Accurate Modeling and Simulation of Substrate Coupling in Mixed-signal Ic's
نویسندگان
چکیده
Industry trends aimed at integrating higher levels of circuit functionality have triggered a proliferation of mixed analog-digital systems. Magniied noise coupling through the common chip substrate has made the design and veriication of such systems an increasingly diicult task. In this paper we present a fast eigendecomposition technique that accelerates operator application in BEM methods and avoids the dense-matrix storage while at the same time taking all of the substrate boundary eeects into account explicitly. This technique can be used for accurate and eecient modeling of substrate coupling eeects in mixed-signal integrated circuits.
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